I. Handling
Main Tasks
- Pick-and-Place: vacuum cup, mechanical gripper grasping
- Palletizing: beverage production line, logistics warehouse
- CNC machine loading/unloading: achieve 24/7 uninterrupted production
Technical Advantages
- Efficiency improved 300%
- Repeat positioning accuracy ±0.02mm
II. Assembly
Application Scenarios
| Scenario | Description |
|---|---|
| Micro precision assembly | Phone assembly, PCB SMT (0201 size) |
| Medium-sized component assembly | Car seats, instrument panels, engines |
| Large structural assembly | Aerospace riveting |
Key Technologies
- Multi-sensor fusion
- Compliant control
- Dual-robot collaboration
Results
- Operation cycle reduced by 30-50%
- Defect rate reduced to 1/5 of manual labor
III. Welding
Welding Types
- Arc welding, spot welding, brazing, laser welding
- Automotive manufacturing: thousands of spot welds on body frames
Technical Advantages
- Cycle time: 3-5 seconds per weld point
- Positioning accuracy: ±0.05mm
- Intelligent features: weld seam tracking, adaptive control
IV. Spraying
Application Scenarios
- Automotive manufacturing: primer, topcoat, clearcoat spraying, 40 bodies/hour
- Home appliance manufacturing: multi-color spraying, electrostatic spraying
- Polishing: force control system maintains constant contact pressure
V. Grasping Technology
Application Fields
- Warehousing and logistics: depalletizing, intelligent picking
- Industrial manufacturing: unordered feeding, waste sorting
Key Technologies
- Multi-modal vision fusion
- Deep learning 6D pose estimation
Market Data
- 2023 global market size: $1.2 billion
- Annual growth rate: 28%
VI. Drawing and Machining
Application Types
- 3D printing: large size, multi-material, spatial printing
- CNC machining: drilling, milling, deburring
- Laser processing: engraving, cutting, marking
VII. Inspection and Testing
Application Scenarios
| Scenario | Effect |
|---|---|
| Dimensional measurement | Complete 58 key dimensions in 30 seconds, accuracy ±0.02mm |
| Functional testing | Inspect 200 phones per hour |
| Surface inspection | Resolution 0.1mm, defect detection rate 99.8% |
| Semiconductor testing | Accuracy ±1μm, 5000 chips per hour |
Advantages
- Speed improved 3-5 times
- Consistency above 99.9%